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晶合集成

20.020

-0.660-3.19%

成交量：3.83万

成交额：77.49万

市值：447.45亿

市盈率：47.43

高：20.680

开：20.680

低：20.000

收：20.680

52周最高：37.000

52周最低：20.000

股本：22.35亿

香港流通股本：2.27亿

量比：3.19

换手率：0.02%

股息：- -

股息率：- -

每股收益(LYR):0.422

净资产收益率：1.59%

总资产收益率：0.76%

市净率：1.64

市盈率(LYR):47.43

市销率: 3.28

数据加载中...

总览公司新闻资讯公告

晶合集成(02249)股价上升5.065%，现价港币$29.04

阿斯达克财经

晶合集成盘中涨近4% 近日拟以合肥瑞昱科技全部股权向安徽瑞晶半导体增资

港股异动 | 晶合集成(02249.HK)涨近4% 近日拟以合肥瑞昱科技全部股权向安徽瑞晶半导体增资

TrendForce：二季度全球前十大晶圆代工厂合计产值接近534.9亿美元再创新高

晶合集成(02249.HK)披露2026年上半年持续督导报告：营收59.57亿元增14.59%，净利降26.12%

晶合集成更新2026年8月股份变动月报，H股新增发行10,886,900股

晶合集成（02249）将于9月10日参加科创板半年度半导体行业业绩说明会

摩根士丹利在晶合集成的H股好仓比例上升0.51%至7.15%

南方财经网

晶合集成(02249.HK)拟以持有的合肥瑞昱科技100%股权向安徽瑞晶半导体增资

晶合集成2.41亿元资产注入安徽瑞晶半导体持股约26.43%

晶合集成2026年半年报：净利润下滑26%，显示驱动芯片占比收缩拖累盈利

晶合集成2026年上半年营收57.66亿元，经调整净利润3.27亿元

晶合集成（02249）完成H股上市后注册资本升至22.35亿元多项议案获董事会通过

晶合集成（02249）聘任方华为副总经理任期至第二届董事会届满

晶合集成（02249）2023年股权激励预留部分首期确认归属14.16万股，同步注销89.38万股

晶合集成(02249)披露2026年上半年募资使用情况：累计投入约90.14亿元，专户余额清零

晶合集成（02249）发布2026年中期业绩：营收57.66亿元同比增12.40%

晶合集成（02249）完成超额配股后修订章程注册资本增至22.35亿元

晶合集成（02249）董事会拟迎来人事调整杨国庆与盛明泉获提名

晶合集成(02249)公布中期业绩拥有人应占利润约2.45亿元同比减少26.12%

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21:41","pubTimestamp":1788529277,"startTime":"0","endTime":"0","summary":"2026年9月4日，中国国际金融股份有限公司向上海证券交易所提交《合肥晶合集成电路股份有限公司2026年半年度持续督导跟踪报告》。报告期覆盖2026年1月1日至6月30日，核心经营及财务数据如下：。营业收入59.57亿元，同比增长14.59%。利润总额2.36亿元，同比增长1.53%。归属于上市公司股东的净利润2.45亿元，同比下降26.12%。中金公司表示，截至本报告出具日，未发现需要额外发表意见的其他事项。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1198119045","title":"晶合集成更新2026年8月股份变动月报，H股新增发行10,886,900股","url":"https://stock-news.laohu8.com/highlight/detail?id=1198119045","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1198119045?lang=zh_cn&edition=fundamental","pubTime":"2026-09-04 16:57","pubTimestamp":1788512220,"startTime":"0","endTime":"0","summary":"合肥晶合集成电路股份有限公司于2026年9月4日发布2026年8月股份变动月报。报告期为2026年8月1日至8月31日。根据公告，因公司部分行使超额配股权，于2026年8月11日增发并配发10,886,900股H股，使公司普通股H股从报告期初的216,167,000股增至227,053,900股。相应地，公司本月底法定注册股本总额达到人民币22.35亿元。A股方面，报告期内已发行股份总数与上月持平，继续保持在2,007,591,697股，其中包括本月末库存A股62,088,500股，主要用于员工激励计划或持股计划。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1124609683","title":"晶合集成（02249）将于9月10日参加科创板半年度半导体行业业绩说明会","url":"https://stock-news.laohu8.com/highlight/detail?id=1124609683","media":"公告速递","labels":["conferences","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1124609683?lang=zh_cn&edition=fundamental","pubTime":"2026-09-02 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17:21","pubTimestamp":1788254460,"startTime":"0","endTime":"0","summary":"南财智讯9月1日电，香港交易所披露信息显示，MorganStanley（摩根士丹利）在晶合集成的H股好仓（L）比例于8月26日从6.64%上升至7.15%。同时淡仓（S）比例从0.05%降至0.02%。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202609013861552291.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202609013861552291.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["02249","688249","BK0214","BK1163"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663807717","title":"晶合集成(02249.HK)拟以持有的合肥瑞昱科技100%股权向安徽瑞晶半导体增资","url":"https://stock-news.laohu8.com/highlight/detail?id=2663807717","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2663807717?lang=zh_cn&edition=fundamental","pubTime":"2026-08-31 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19:11","pubTimestamp":1788174697,"startTime":"0","endTime":"0","summary":"2026年8月31日，晶合集成公告称，公司已与安徽瑞晶半导体有限公司、现有股东及其他增资方签署《增资及股东协议》，拟通过股权出资及现金方式共同向目标公司增资4.11亿元。根据协议，晶合集成将以合肥瑞昱科技100%股权作价2.41亿元出资，认购目标公司等额新增注册资本；其他增资方合计以现金1.70亿元认购目标公司新增注册资本。增资完成后，目标公司注册资本将由5.01亿元增至9.11亿元，晶合集成将直接持有目标公司约26.43%股权。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2663014243","title":"晶合集成2026年半年报：净利润下滑26%，显示驱动芯片占比收缩拖累盈利","url":"https://stock-news.laohu8.com/highlight/detail?id=2663014243","media":"蓝鲸财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2663014243?lang=zh_cn&edition=fundamental","pubTime":"2026-08-29 15:29","pubTimestamp":1787988573,"startTime":"0","endTime":"0","summary":"报告期内，公司实现营业收入57.66亿元人民币，同比增长12.40%；归属于上市公司股东的净利润为2.45亿元人民币，同比下降26.12%。截至2026年6月30日，公司资产总额达587.83亿元人民币，负债总额为276.56亿元人民币，基本每股收益为0.13元人民币。管理层指出，报告期内研发开支为7.59亿元人民币，占收入比重13.17%，其中符合资本化条件的项目进入开发阶段致使费用化研发投入同比下降12.32%。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.lanjinger.com/d/1787986428261697240","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"lanjinger_stock","symbols":["688249","BK1163","02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1101414488","title":"晶合集成2026年上半年营收57.66亿元，经调整净利润3.27亿元","url":"https://stock-news.laohu8.com/highlight/detail?id=1101414488","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1101414488?lang=zh_cn&edition=fundamental","pubTime":"2026-08-28 17:48","pubTimestamp":1787910520,"startTime":"0","endTime":"0","summary":"晶合集成公布2026年上半年业绩，营收为57.66亿元，同比增长12.40%。经调整净利润为3.27亿元，同比下降3.25%。经营利润约5.67亿元，经营利润率为9.83%，较上年同期提高2.30个百分点。期内经营活动现金流净额为27.98亿元，同比增长64.10%。上半年销售和管理费用总体增至3.04亿元。公司预期2026年第三季度营收规模约为32.00亿元至33.00亿元，并预计届时毛利率在25%至27%范围。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"晶合集成2026年上半年营收57.66亿元，经调整净利润3.27亿元","news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1194735835","title":"晶合集成（02249）完成H股上市后注册资本升至22.35亿元 多项议案获董事会通过","url":"https://stock-news.laohu8.com/highlight/detail?id=1194735835","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1194735835?lang=zh_cn&edition=fundamental","pubTime":"2026-08-24 21:56","pubTimestamp":1787579796,"startTime":"0","endTime":"0","summary":"2026年8月25日，合肥晶合集成电路股份有限公司公告披露，第二届董事会第三十七次会议于2026年8月24日召开，全部9名董事出席并审议通过11项议案，核心内容如下：。– 公司完成H股发行上市后，总股本由2,007,591,697股增至2,234,645,597股。– 注册资本同步由人民币2,007,591,697元调整为人民币2,234,645,597元，折合约22.35亿元。– 公司将按程序向市场监督管理部门办理注册资本及《公司章程》变更、备案手续。上述全部议案均以9票赞成、0票反对、0票弃权获得通过。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1111960588","title":"晶合集成（02249）聘任方华为副总经理  任期至第二届董事会届满","url":"https://stock-news.laohu8.com/highlight/detail?id=1111960588","media":"公告速递","labels":["executive","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1111960588?lang=zh_cn&edition=fundamental","pubTime":"2026-08-24 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21:46","pubTimestamp":1787579173,"startTime":"0","endTime":"0","summary":"2026年8月24日，晶合集成电路股份有限公司董事会召开第二届董事会第三十七次会议，审议通过两项与2023年限制性股票激励计划相关的核心议案：。归属价格与授予信息：上述股份的授予日为2024年5月31日，授予价格经2024年度权益分派调整后为每股9.97元。余额情况：本次注销后，2023年限制性股票激励计划剩余已授予但尚未归属的限制性股票为11,261,848股。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1188646022","title":"晶合集成(02249)披露2026年上半年募资使用情况：累计投入约90.14亿元，专户余额清零","url":"https://stock-news.laohu8.com/highlight/detail?id=1188646022","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1188646022?lang=zh_cn&edition=fundamental","pubTime":"2026-08-24 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20:23","pubTimestamp":1787574209,"startTime":"0","endTime":"0","summary":"2026年8月24日，晶合集成公布截至2026年6月30日止六个月未经审计的中期业绩。公司期内实现收入57.66亿元，同比增长12.40%；毛利12.33亿元，同比下降2.14%；毛利率为21.38%。除所得税前利润2.36亿元，同比增长1.53%；期内利润2.22亿元，同比下降4.52%。其中，本公司拥有人应占利润2.45亿元，同比下降26.12%；基本每股收益0.13元，上年同期为0.17元。经营活动产生的现金流量净额27.98亿元，同比增长64.10%。公司预计2026年第三季度收入约32亿元至33亿元，毛利率约25%至27%。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1157278119","title":"晶合集成（02249）完成超额配股后修订章程 注册资本增至22.35亿元","url":"https://stock-news.laohu8.com/highlight/detail?id=1157278119","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1157278119?lang=zh_cn&edition=fundamental","pubTime":"2026-08-24 20:22","pubTimestamp":1787574179,"startTime":"0","endTime":"0","summary":"2026年8月24日，晶合集成公告称，公司已针对全球发售及部分行使超额配股权后的资本变动，对《公司章程》相关条款进行修订。公司于2026年7月10日发行216,167,000股H股；2026年8月6日，承销商部分行使超额配股权，额外发行10,886,900股H股。加上原有A股2,007,591,697股，公司总股本增至2,234,645,597股，每股面值人民币1.00元。与H股发行及注册资本变更相关的条款自2026年8月24日起生效，其余条款仍待股东大会审议通过。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1105273273","title":"晶合集成（02249）董事会拟迎来人事调整 杨国庆与盛明泉获提名","url":"https://stock-news.laohu8.com/highlight/detail?id=1105273273","media":"公告速递","labels":["executive","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1105273273?lang=zh_cn&edition=fundamental","pubTime":"2026-08-24 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同比减少26.12%","url":"https://stock-news.laohu8.com/highlight/detail?id=2661764672","media":"智通财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2661764672?lang=zh_cn&edition=fundamental","pubTime":"2026-08-24 20:18","pubTimestamp":1787573931,"startTime":"0","endTime":"0","summary":"智通财经APP讯，晶合集成 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