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晶合集成

20.340

-0.340-1.64%

成交量：81.62万

成交额：1,631.87万

市值：454.60亿

市盈率：48.21

高：20.680

开：20.680

低：19.740

收：20.680

52周最高：37.000

52周最低：19.740

股本：22.35亿

香港流通股本：2.27亿

量比：1.36

换手率：0.36%

股息：- -

股息率：- -

每股收益(LYR):0.422

净资产收益率：1.59%

总资产收益率：0.76%

市净率：1.67

市盈率(LYR):48.21

市销率: 3.33

数据加载中...

总览公司新闻资讯公告

晶合集成(02249)建议委任杨国庆为非执行董事

异动解读｜晶合集成盘中下跌3.43%，日本特气出口管制落地叠加半导体板块集体回调

异动解读｜晶合集成盘中上涨3.06%，中期业绩发布在即叠加半导体板块走强

财报前瞻｜晶合集成本季度营收预计增23.05%，机构观点偏多

异动解读｜晶合集成盘中上涨3.41%，中期业绩发布在即叠加半导体龙头带动

异动解读｜晶合集成盘中上涨3.33%，半导体板块持续反弹叠加港股通资金承接

晶合集成（02249）拟于8月24日召开董事会审议2026年中期业绩及分红事宜

异动解读｜晶合集成盘中上涨3.43%，半导体板块集体反弹叠加超额配售消化顺利

晶合集成(02249)超额配售稀释华勤系持股比例至10.98%

晶合集成部分行使超额配股权发行约1088.69万股H股

晶合集成(02249.HK)因超额配股权获部分行使而发行1088.69万股

异动解读｜晶合集成盘中上涨3.16%，超额配售股份上市首日获多方资金承接

异动解读｜晶合集成盘中下跌3.05%，半导体板块集体走弱叠加超额配售股份即将上市

港股异动 | 晶合集成升逾4%，今起正式进入港股通，公司聚焦12英寸晶圆代工业务

异动解读｜晶合集成盘中上涨3.14%，获调入港股通标的名单今日生效

港股通标的证券名单调入晶合集成，今日起生效

老虎资讯综合

晶合集成(02249.HK)获调入沪深港通下的港股通标的名单

深交所公告，港股通标的证券名单调入晶合集成，自2026年08月07日起生效。

晶合集成(02249.HK)超额配股权获部分行使额外筹3.45亿元

阿斯达克财经

晶合集成(02249.HK)：部分行使超额配股权、稳定价格行动及稳定价格期结束

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｜晶合集成本季度营收预计增23.05%，机构观点偏多","url":"https://stock-news.laohu8.com/highlight/detail?id=1133576496","media":"财报Agent","labels":["earningPreview"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1133576496?lang=zh_cn&edition=fundamental","pubTime":"2026-08-17 08:06","pubTimestamp":1786925165,"startTime":"0","endTime":"0","summary":"晶合集成将于2026年08月24日盘后发布截至2026年06月30日止中期业绩，市场普遍关注收入修复与利润率走向。市场一致预期本季度晶合集成营收为33.56亿元，同比增长23.05%，EPS为0.12元，同比增长50.00%，EBIT为3.04亿元，同比增长26.88%；目前未见一致口径的毛利率与净利润或净利率预测。上季度公司实现营收29.12亿元，同比增长13.41%；毛利率为21.26%，较上年同期约27.25%下降6.00个百分点；净利率为1.74%；归母净利润为5065.86万元，同比下降62.61%；调整后每股收益为0.03元，同比下降57.14%。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"财报前瞻 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16:43","pubTimestamp":1786524206,"startTime":"0","endTime":"0","summary":"晶合集成（02249）8月12日在港交所公告，公司董事会已订于2026年8月24日（星期一）召开会议。会议将审议并批准公司及其附属公司截至2026年6月30日止六个月的中期业绩及其发布事宜，并考虑建议派发中期股息（如有），同时处理其他相关事项。\n此次董事会成员包括：执行董事蔡国智先生、朱才伟先生；非执行董事陆勤航先生、陈小蓓女士、郭兆志先生及邱文生先生；独立非执行董事安广实教授、藺智挺教授及陈鋌先生。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1146748023","title":"异动解读｜晶合集成盘中上涨3.43%，半导体板块集体反弹叠加超额配售消化顺利","url":"https://stock-news.laohu8.com/highlight/detail?id=1146748023","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1146748023?lang=zh_cn&edition=fundamental","pubTime":"2026-08-12 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