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晶合集成

26.660

+0.6602.54%

成交量：74.32萬

成交額：2,002.01萬

市值：595.85億

市盈率：66.55

高：27.440

開：26.500

低：26.420

收：26.000

52周最高：37.000

52周最低：26.000

股本：22.35億

香港流通股本：2.27億

量比：0.55

換手率：0.33%

股息：- -

股息率：- -

每股收益(LYR):0.401

淨資產收益率：1.59%

總資產收益率：0.76%

市淨率：2.19

市盈率(LYR):66.55

市銷率: 4.38

資料載入中...

總覽公司新聞資訊公告

港股異動 | 晶合集成(02249)升逾3% 公司28nm邏輯工藝平台已導入客户樣品流片驗證中

晶合集成(02249)股價上升5%，現價港幣$27.3

阿斯达克财经

晶合集成2023年股權激勵預留部分首批歸屬14.16萬股 9月18日上市流通

晶合集成（02249）141,613股限制性股票將於9月18日上市流通

摩根士丹利在晶合集成的H股好倉比例上升1.26%至6.71%

南方财经网

晶合集成：後續代工報價會綜合市場需求等因素綜合考慮

晶合集成(02249)股價上升5.065%，現價港幣$29.04

阿斯达克财经

晶合集成盤中漲近4% 近日擬以合肥瑞昱科技全部股權向安徽瑞晶半導體增資

港股異動 | 晶合集成(02249.HK)漲近4% 近日擬以合肥瑞昱科技全部股權向安徽瑞晶半導體增資

TrendForce：二季度全球前十大晶圓代工廠合計產值接近534.9億美元再創新高

晶合集成(02249.HK)披露2026年上半年持續督導報告：營收59.57億元增14.59%，淨利降26.12%

晶合集成更新2026年8月股份變動月報，H股新增發行10,886,900股

晶合集成（02249）將於9月10日參加科創板半年度半導體行業業績説明會

摩根士丹利在晶合集成的H股好倉比例上升0.51%至7.15%

南方财经网

晶合集成(02249.HK)擬以持有的合肥瑞昱科技100%股權向安徽瑞晶半導體增資

晶合集成2.41億元資產注入安徽瑞晶半導體持股約26.43%

晶合集成2026年半年報：淨利潤下滑26%，顯示驅動芯片佔比收縮拖累盈利

晶合集成2026年上半年營收57.66億元，經調整淨利潤3.27億元

晶合集成（02249）完成H股上市後註冊資本升至22.35億元多項議案獲董事會通過

晶合集成（02249）聘任方華為副總經理任期至第二屆董事會屆滿

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17:53","pubTimestamp":1789379611,"startTime":"0","endTime":"0","summary":"2026年9月15日，合肥晶合集成电路股份有限公司公告称，2023年限制性股票激励计划预留授予部分第一个归属期的股份登记工作已完成，本次归属股份141,613股将于2026年9月18日上市流通。本次归属数量占上述5人获授限制性股票总量的9.73%。股本结构方面，本次新增141,613股后，晶合集成A股股本由2,007,591,697股增至2,007,733,310股；公司总股本由2,234,645,597股增至2,234,787,210股，增幅约0.0063%。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"a3893e2538b44a4c9453f52433cb6ed2","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2667541436","title":"摩根士丹利在晶合集成的H股好倉比例上升1.26%至6.71%","url":"https://stock-news.laohu8.com/highlight/detail?id=2667541436","media":"南方财经网","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2667541436?lang=zh_tw&edition=fundamental","pubTime":"2026-09-14 17:19","pubTimestamp":1789377572,"startTime":"0","endTime":"0","summary":"南财智讯9月14日电，香港交易所披露信息显示，MorganStanley（摩根士丹利）在晶合集成的H股好仓（L）比例于9月9日从5.45%上升至6.71%。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202609143873497715.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202609143873497715.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["02249","BK1163","BK0214","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2666672645","title":"晶合集成：後續代工報價會綜合市場需求等因素綜合考慮","url":"https://stock-news.laohu8.com/highlight/detail?id=2666672645","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666672645?lang=zh_tw&edition=fundamental","pubTime":"2026-09-10 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再創新高","url":"https://stock-news.laohu8.com/highlight/detail?id=2666533583","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666533583?lang=zh_tw&edition=fundamental","pubTime":"2026-09-09 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15:29","pubTimestamp":1787988573,"startTime":"0","endTime":"0","summary":"报告期内，公司实现营业收入57.66亿元人民币，同比增长12.40%；归属于上市公司股东的净利润为2.45亿元人民币，同比下降26.12%。截至2026年6月30日，公司资产总额达587.83亿元人民币，负债总额为276.56亿元人民币，基本每股收益为0.13元人民币。管理层指出，报告期内研发开支为7.59亿元人民币，占收入比重13.17%，其中符合资本化条件的项目进入开发阶段致使费用化研发投入同比下降12.32%。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.lanjinger.com/d/1787986428261697240","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"lanjinger_stock","symbols":["02249","BK1163","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1101414488","title":"晶合集成2026年上半年營收57.66億元，經調整淨利潤3.27億元","url":"https://stock-news.laohu8.com/highlight/detail?id=1101414488","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1101414488?lang=zh_tw&edition=fundamental","pubTime":"2026-08-28 17:48","pubTimestamp":1787910520,"startTime":"0","endTime":"0","summary":"晶合集成公布2026年上半年业绩，营收为57.66亿元，同比增长12.40%。经调整净利润为3.27亿元，同比下降3.25%。经营利润约5.67亿元，经营利润率为9.83%，较上年同期提高2.30个百分点。期内经营活动现金流净额为27.98亿元，同比增长64.10%。上半年销售和管理费用总体增至3.04亿元。公司预期2026年第三季度营收规模约为32.00亿元至33.00亿元，并预计届时毛利率在25%至27%范围。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"晶合集成2026年上半年营收57.66亿元，经调整净利润3.27亿元","news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1194735835","title":"晶合集成（02249）完成H股上市後註冊資本升至22.35億元 多項議案獲董事會通過","url":"https://stock-news.laohu8.com/highlight/detail?id=1194735835","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1194735835?lang=zh_tw&edition=fundamental","pubTime":"2026-08-24 21:56","pubTimestamp":1787579796,"startTime":"0","endTime":"0","summary":"2026年8月25日，合肥晶合集成电路股份有限公司公告披露，第二届董事会第三十七次会议于2026年8月24日召开，全部9名董事出席并审议通过11项议案，核心内容如下：。– 公司完成H股发行上市后，总股本由2,007,591,697股增至2,234,645,597股。– 注册资本同步由人民币2,007,591,697元调整为人民币2,234,645,597元，折合约22.35亿元。– 公司将按程序向市场监督管理部门办理注册资本及《公司章程》变更、备案手续。上述全部议案均以9票赞成、0票反对、0票弃权获得通过。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1111960588","title":"晶合集成（02249）聘任方華為副總經理  任期至第二屆董事會屆滿","url":"https://stock-news.laohu8.com/highlight/detail?id=1111960588","media":"公告速递","labels":["executive","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1111960588?lang=zh_tw&edition=fundamental","pubTime":"2026-08-24 21:56","pubTimestamp":1787579781,"startTime":"0","endTime":"0","summary":"合肥晶合集成电路股份有限公司8月25日公告称，公司已于2026年8月24日召开第二届董事会第三十七次会议，通过《关于聘任公司高级管理人员的议案》，决定聘任方华为公司副总经理。方华自议案审议通过之日起正式就任，其任期至公司第二届董事会任期届满时止。截至公告披露日，方华未直接持有公司股份，与公司实际控制人、其他董事及持股5%以上股东不存在关联关系；未受到中国证监会及证券交易所的处罚，也不属于失信被执行人。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"executive,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":8,"pageCount":1,"totalSize":158,"code":"91000000","status":"200"}]}}