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晶合集成

26.660

+0.6602.54%

成交量：74.32萬

成交額：2,002.01萬

市值：595.85億

市盈率：66.55

高：27.440

開：26.500

低：26.420

收：26.000

52周最高：37.000

52周最低：26.000

股本：22.35億

香港流通股本：2.27億

量比：0.55

換手率：0.33%

股息：- -

股息率：- -

每股收益(LYR):0.401

淨資產收益率：1.59%

總資產收益率：0.76%

市淨率：2.19

市盈率(LYR):66.55

市銷率: 4.38

資料載入中...

總覽公司新聞資訊公告

晶合集成（02249）2023年股權激勵預留部分首期確認歸屬14.16萬股，同步註銷89.38萬股

晶合集成(02249)披露2026年上半年募資使用情況：累計投入約90.14億元，專户餘額清零

晶合集成（02249）發布2026年中期業績：營收57.66億元按年增12.40%

晶合集成（02249）完成超額配股後修訂章程註冊資本增至22.35億元

晶合集成（02249）董事會擬迎來人事調整楊國慶與盛明泉獲提名

晶合集成(02249)公布中期業績擁有人應占利潤約2.45億元按年減少26.12%

晶合集成(02249)建議委任楊國慶為非執行董事

異動解讀｜晶合集成盤中下跌3.43%，日本特氣出口管制落地疊加半導體板塊集體回調

異動解讀｜晶合集成盤中上漲3.06%，中期業績發布在即疊加半導體板塊走強

財報前瞻｜晶合集成本季度營收預計增23.05%，機構觀點偏多

異動解讀｜晶合集成盤中上漲3.41%，中期業績發布在即疊加半導體龍頭帶動

異動解讀｜晶合集成盤中上漲3.33%，半導體板塊持續反彈疊加港股通資金承接

晶合集成（02249）擬於8月24日召開董事會審議2026年中期業績及派息事宜

異動解讀｜晶合集成盤中上漲3.43%，半導體板塊集體反彈疊加超額配售消化順利

晶合集成(02249)超額配售稀釋華勤系持股比例至10.98%

晶合集成部分行使超額配股權發行約1088.69萬股H股

晶合集成(02249.HK)因超額配股權獲部分行使而發行1088.69萬股

異動解讀｜晶合集成盤中上漲3.16%，超額配售股份上市首日獲多方資金承接

異動解讀｜晶合集成盤中下跌3.05%，半導體板塊集體走弱疊加超額配售股份即將上市

港股異動 | 晶合集成升逾4%，今起正式進入港股通，公司聚焦12英寸晶圓代工業務

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14:49","pubTimestamp":1787035754,"startTime":"0","endTime":"0","summary":"8月18日，晶合集成盘中下跌3.43%，报35.44港元/股，成交额7781.25万港元。晶合集成作为12英寸晶圆代工企业，特气为生产核心耗材，管制落地加剧市场对供应链成本及交付周期的担忧。板块方面，半导体产品行业当日整体走弱，华虹宏力跌4.65%、兆易创新跌5.32%、澜起科技跌6.37%，行业共振回调拖累股价。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":"晶合集成盘中下跌3.43%，日本特气出口管制落地叠加半导体板块集体回调","news_tag":"policyRegulatory","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1168738626","title":"異動解讀｜晶合集成盤中上漲3.06%，中期業績發布在即疊加半導體板塊走強","url":"https://stock-news.laohu8.com/highlight/detail?id=1168738626","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1168738626?lang=zh_tw&edition=fundamental","pubTime":"2026-08-17 10:17","pubTimestamp":1786933036,"startTime":"0","endTime":"0","summary":"8月17日，晶合集成盘中上涨3.06%，报35.7港元/股，成交额2376.22万港元。消息面上，公司将于8月24日发布截至6月30日止中期业绩，市场一致预期本季度营收33.56亿元，同比增长23.05%，EPS为0.12元，同比增长50.00%，业绩窗口临近催化市场情绪。同业方面，中芯国际当日涨4.24%、华虹宏力涨5.45%，半导体板块整体走强形成联动效应。此外，华勤技术此前增持公司股份至11.03%、GIC增持至5.30%，机构资金持续入场为股价提供支撑。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"晶合集成盘中上涨3.06%，中期业绩发布在即叠加半导体板块走强","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1133576496","title":"財報前瞻 ｜晶合集成本季度營收預計增23.05%，機構觀點偏多","url":"https://stock-news.laohu8.com/highlight/detail?id=1133576496","media":"财报Agent","labels":["earningPreview"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1133576496?lang=zh_tw&edition=fundamental","pubTime":"2026-08-17 08:06","pubTimestamp":1786925165,"startTime":"0","endTime":"0","summary":"晶合集成将于2026年08月24日盘后发布截至2026年06月30日止中期业绩，市场普遍关注收入修复与利润率走向。市场一致预期本季度晶合集成营收为33.56亿元，同比增长23.05%，EPS为0.12元，同比增长50.00%，EBIT为3.04亿元，同比增长26.88%；目前未见一致口径的毛利率与净利润或净利率预测。上季度公司实现营收29.12亿元，同比增长13.41%；毛利率为21.26%，较上年同期约27.25%下降6.00个百分点；净利率为1.74%；归母净利润为5065.86万元，同比下降62.61%；调整后每股收益为0.03元，同比下降57.14%。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"财报前瞻 ｜晶合集成本季度营收预计增23.05%，机构观点偏多","news_tag":"earningPreview","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1187037462","title":"異動解讀｜晶合集成盤中上漲3.41%，中期業績發布在即疊加半導體龍頭帶動","url":"https://stock-news.laohu8.com/highlight/detail?id=1187037462","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1187037462?lang=zh_tw&edition=fundamental","pubTime":"2026-08-14 13:39","pubTimestamp":1786685964,"startTime":"0","endTime":"0","summary":"8月14日，晶合集成盘中上涨3.41%，报35.16港元/股，成交额5674.59万港元。消息面上，公司董事会定于8月24日召开会议，审议截至6月30日止六个月的中期业绩并考虑派发中期股息，业绩窗口临近催化市场情绪。同业中芯国际当日涨6.66%，半导体板块龙头持续走强带动行业热度。此外，公司8月7日纳入港股通标的后，叠加GIC增持至5.30%、华勤技术增持至11.03%等机构资金持续入场，为股价提供资金面支撑。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1153608159","title":"異動解讀｜晶合集成盤中上漲3.33%，半導體板塊持續反彈疊加港股通資金承接","url":"https://stock-news.laohu8.com/highlight/detail?id=1153608159","media":"行情直击","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1153608159?lang=zh_tw&edition=fundamental","pubTime":"2026-08-13 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16:43","pubTimestamp":1786524206,"startTime":"0","endTime":"0","summary":"晶合集成（02249）8月12日在港交所公告，公司董事会已订于2026年8月24日（星期一）召开会议。会议将审议并批准公司及其附属公司截至2026年6月30日止六个月的中期业绩及其发布事宜，并考虑建议派发中期股息（如有），同时处理其他相关事项。\n此次董事会成员包括：执行董事蔡国智先生、朱才伟先生；非执行董事陆勤航先生、陈小蓓女士、郭兆志先生及邱文生先生；独立非执行董事安广实教授、藺智挺教授及陈鋌先生。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1146748023","title":"異動解讀｜晶合集成盤中上漲3.43%，半導體板塊集體反彈疊加超額配售消化順利","url":"https://stock-news.laohu8.com/highlight/detail?id=1146748023","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1146748023?lang=zh_tw&edition=fundamental","pubTime":"2026-08-12 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20:45","pubTimestamp":1786452335,"startTime":"0","endTime":"0","summary":"2026年8月12日，合肥晶合集成电路股份有限公司披露，被动稀释导致华勤技术股份有限公司及其一致行动人合计持股比例下降至10.98%。\\n\\n根据公告，晶合集成于2026年7月10日在香港联合交易所主板挂牌上市后，整体协调人于2026年8月6日部分行使超额配售权，涉及10,886,900股H股。华勤技术股份有限公司及其一致行动人合肥勤合电子科技有限公司、华勤通讯香港有限公司所持股份数保持24,526.4594万股不变，但持股比例由11.03%被动稀释至10.98%，触及1%的变动刻度。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1112287189","title":"晶合集成部分行使超額配股權發行約1088.69萬股H股","url":"https://stock-news.laohu8.com/highlight/detail?id=1112287189","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1112287189?lang=zh_tw&edition=fundamental","pubTime":"2026-08-11 18:52","pubTimestamp":1786445532,"startTime":"0","endTime":"0","summary":"2026年8月11日，晶合集成（股票代码：02249）发布翌日披露报表显示，公司于当日根据部分行使超额配股权发行并配发H股合计约1088.69万股（即10,886,900股），占发行前已发行股份（不含库存股份）约5.04%。\n本次发行的每股价格为32.3港元。发行完成后，晶合集成已发行股份总数（不含库存股份）由原先的2.16亿股（216,167,000股）增至2.27亿股（227,053,900股）。\n公司在公告中强调，本次股份发行已获得董事会正式授权，并遵守香港联合交易所有限公司证券上市规则及相关法律法规。公告由联席公司秘书朱才伟签署。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"晶合集成部分行使超额配股权发行约1088.69万股H股","news_tag":"shareholding,SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2658499459","title":"晶合集成(02249.HK)因超額配股權獲部分行使而發行1088.69萬股","url":"https://stock-news.laohu8.com/highlight/detail?id=2658499459","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2658499459?lang=zh_tw&edition=fundamental","pubTime":"2026-08-11 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10:17","pubTimestamp":1786414648,"startTime":"0","endTime":"0","summary":"8月11日，晶合集成盘中上涨3.16%，报33.28港元/股，成交额1561.08万港元。消息面上，公司超额配售的10,886,900股H股于今日在香港联交所上市，发行价为每股32.30港元。此前市场担忧新增流通股份带来供给压力，8月10日股价一度下跌3.05%，但今日股价站稳配售价上方，显示市场对新增供给消化较为顺利。资金面上，公司已于8月7日被纳入港股通标的，叠加华勤技术近期持续增持至11.03%、GIC增持至5.30%等多方机构资金入场，为股价提供支撑。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1121003894","title":"異動解讀｜晶合集成盤中下跌3.05%，半導體板塊集體走弱疊加超額配售股份即將上市","url":"https://stock-news.laohu8.com/highlight/detail?id=1121003894","media":"行情直击","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1121003894?lang=zh_tw&edition=fundamental","pubTime":"2026-08-10 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