Ingenic Discloses H1 Assets, Liabilities Ahead of Hong Kong Listing
MT Newswires Live
Aug 11
Ingenic Semiconductor (SHE:300223) published the details of its assets and liabilities for the first half in relation to its application for its Hong Kong listing, according to a Monday disclosure on the Shenzhen bourse.
The Chinese semiconductor company's shares rose 1% during Tuesday's midday trade.
The company's unaudited assets as of June 30 were 9.73 billion yuan, higher than 8.69 billion yuan as of Jan. 1.
Liabilities during the first half were 1.28 billion yuan, also higher than those as of Jan. 1, which amounted to almost 1 billion yuan.
Meanwhile, short-term debt amounted to 8.4 million yuan, while long-term debt was at 7.4 million yuan during the same period.
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