The Shenzhen Municipal Bureau of Industry and Information Technology has recently issued the "Shenzhen Action Plan for Accelerating High-Quality Development of the AI Server Industry Chain (2026–2028)." The plan proposes support for the research, development, and application of memory chips, with an emphasis on accelerating breakthroughs in advanced packaging technologies. It highlights the need to prioritize the development of high-end storage products such as enterprise-grade solid-state drives and enterprise-grade memory modules. Additionally, the plan calls for strengthening R&D in emerging technologies like near-memory packaging and memory-computing integration. These efforts aim to enhance the supply capacity of high-end storage solutions and build a product supply system suitable for large-scale model training and supercomputing centers.