On July 6, ASE Technology rose 3.44% in pre-market trading, trading at $42.15/share, with turnover of $112,100.

On the news front, the company announced on July 1 another round of advanced packaging price increases, with hikes exceeding 20%, covering wafer-level substrate chip packaging and fan-out substrate chip packaging. Key US clients are all included in the repricing scope.

Bank of America raised its valuation estimate for ASE Technology, projecting that the server CPU-related packaging and testing market could expand from $1.9 billion to $9.6 billion, noting that advanced packaging remains the highest-barrier segment in the supply chain. Nearly 20 semiconductor companies globally initiated a new wave of price increases in July, signaling continued improvement in industry conditions.

Additionally, the company is aggressively expanding capacity with 15 new sites planned, including greenfield facilities and recently acquired assets, with capital expenditure budgeted at $8.5 billion for the year to support long-term AI-driven chip demand.

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