Ingenic Semiconductor Co., Ltd. (HKEx: 03223) is offering shares for subscription from August 17, 2026, to August 20, 2026. The company plans to globally offer 31.2873 million H-shares, with 10% allocated for the Hong Kong public offering and 90% for international placement, alongside a 15% over-allotment option. The maximum offer price per share is set at HKD 102.80, with each trading lot consisting of 100 H-shares. Trading is expected to commence on the Stock Exchange of Hong Kong at 9:00 a.m. on Tuesday, August 25, 2026.

The company operates under a fabless model, focusing on chip research and development while collaborating with leading foundries and semiconductor packaging and testing firms to ensure scalability. Through a combination of organic growth and strategic acquisitions, Ingenic Semiconductor Co., Ltd. has built a comprehensive product portfolio. According to Frost & Sullivan, the company holds a leading position in key global markets, continuously driving innovation in areas such as automotive electronics and edge computing.

For the fiscal years 2023, 2024, and 2025, as well as the three months ended March 31, 2026, the company's research and development expenses were RMB 708.3 million, RMB 681.3 million, RMB 712 million, and RMB 171.9 million, respectively. These figures accounted for 15.6%, 16.2%, 15.0%, and 11.0% of total revenue for the corresponding periods.

The company has entered into cornerstone investment agreements with several investors, including Emerald Prime, GF Fund, Perseverance Asset Management, Shanghai Gaoyi and Huatai Capital Investment (related to Huatai back-to-back total return swaps and Huatai client total return swaps), Singapore Huaqin, ICBC Wealth Management, Arrow Target, China Universal (Hong Kong), Singularity Asset, Heading Pioneer 10 Fund LPF, and Dream'ee HK Fund. Under these agreements, the cornerstone investors have agreed, subject to certain conditions, to subscribe for or procure their designated entities to subscribe for the number of shares they can purchase at the offer price (rounded down to the nearest board lot of 100 H-shares), with a total subscription amount of approximately USD 192 million.

Assuming the maximum offer price of HKD 102.80 per share, the company estimates that, after deducting underwriting commissions and other estimated expenses related to the global offering (assuming the over-allotment option is not exercised), it will receive net proceeds of approximately HKD 3.1412 billion. The company plans to allocate the proceeds as follows: approximately 50% will be used to strengthen technological innovation and product development across its three core product lines—memory chips, computing chips, and analog chips. About 25% will be directed toward strategic investments and/or acquisitions to capture growth opportunities. Around 15% will be used to expand the company's network and promote its products. The remaining 10% will be allocated as working capital and for other general corporate purposes, including daily operations and general corporate expenses.