On August 4, Intel rose 4.17% in regular trading, trading at $96.525/share, with turnover of $949 million. The stock gained momentum from pre-market through intraday trading on dual catalysts related to its advanced packaging business.

On the news front, Intel's EMIB-T advanced packaging technology yield has surpassed 90%, with mass production expected next year. Simultaneously, MediaTek publicly confirmed for the first time during its earnings briefing that its ASIC project has adopted Intel's EMIB-T packaging technology. According to disclosed data, EMIB-T costs approximately 50% less than TSMC's CoWoS solution, and Intel plans to offer large-scale EMIB-T packaging services next year. MediaTek's simultaneous investment in both TSMC CoWoS and Intel EMIB-T routes reflects that packaging has become a core competitive dimension in AI chip solutions.

Notably, while EMIB-T packaging yield has reached 90%, substrate yield remains at approximately 50%, posing the primary bottleneck for capacity expansion. Supplier Unimicron indicated the technology is still in early development with focus on ramping capacity and improving yields.

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