CIG Plans Share Placement and Bond Issuance to Raise Over HK$6.5 Billion for Optical Module Capacity Expansion

Stock News
7 hours ago

Hong Kong Stock Announcement Highlights: Cambridge Technology plans share placement and bond issuance to raise over HK$6.5 billion in net proceeds to boost optical module capacity.

Major Developments

CIG (06166) plans a share placement at approximately 8% discount and issuance of RMB 3.96 billion in convertible bonds, raising over HK$6.5 billion in net proceeds. Ribo Biotech-B (06938) submitted a Phase I clinical trial application for RBD3133 injection for the treatment of overweight and obesity. A 67 MW AIDC project in Southeast Asia has been launched, with Zhiyuan Holdings (00990) accelerating its strategic transformation. Ledo Robot (01236) plans to acquire the entire equity of SABO-Maschinenfabrik GmbH for no more than EUR 6 million. Biren Technology (06082) plans to issue 130 million new H shares, raising approximately HK$4.0197 billion in net proceeds.

Financial Reports

Greentown China (03900) reported cumulative total contracted sales of approximately RMB 142.1 billion for the first nine months. Sasa International (00178): during the 2026 National Day holiday, offline sales in Hong Kong and Macau increased over 60% year-on-year, with same-store sales also rising over 50% year-on-year. Sasa International (00178) recorded total quarterly revenue of HK$1.4138 billion in the second quarter, up 37.2% year-on-year.

Shareholder Increases and Buybacks

XtalPi Holdings (02228) received a share increase of 1.3 million shares from Chairman Wen Shuhao. Tencent Holdings (00700) repurchased 238,000 shares on October 7 for HK$100.3 million.

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