On July 3, ASMPT rose 3.4% in regular trading, trading at 201.0 HKD/share with turnover of 636 million HKD, rebounding from the prior session's sharp 11.89% decline.

On the news front, Applied Materials publicly unveiled its 3D chip manufacturing equipment product line targeting AI semiconductors, focusing on high-bandwidth memory and chiplet applications, reinforcing demand visibility for the global equipment supply chain. Additionally, the Korean government's announcement of approximately 800 trillion KRW in semiconductor and AI industry investment — with Samsung Electronics and SK Hynix committing 81 trillion KRW to build an advanced packaging base for HBM expansion — continues to underpin positive sentiment for upstream equipment suppliers including ASMPT.

ASMPT's Q1 results showed new orders of 5.67 billion HKD, up 46% quarter-over-quarter, while revenue grew 32% year-over-year. The company's TCB equipment maintains a leading market position with approximately 35-40% global share, and demand is expected to accelerate as HBM production scales toward 16-layer and 20-layer architectures.

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