美股详情

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Corgi UMC 2x Daily ETF

15.28

-0.3969-2.53%

成交量：1,502

成交额：2.29万

市值：61.13万

市盈率：- -

高：15.28

开：14.75

低：14.75

收：15.68

52周最高：30.30

52周最低：9.99

股本：4.00万

流通股本：4.00万

量比：0.29

换手率：3.76%

股息：- -

股息率：- -

净资产收益率：--

总资产收益率：--

市净率：--

市盈率(LYR):- -

数据加载中...

总览公司新闻资讯公告

中证转债指数开盘下跌0.37%。华懋转债、联瑞转债、欧通转债、强达转债、亿田转债跌幅居前，分别下跌4.01%、3.89%

群智咨询：2026年Q4全球晶圆厂产能利用率预计达91% 晶圆代工价格整体上涨

中证转债指数开盘下跌0.07%。联瑞转债、颀中转债、中仑转债、盛德转债、蓝晓转02跌幅居前，分别跌1.79%、1.77%

United Microelectronics Corp(UMC)股票10月5日盘中下跌9.95%：关键驱动因素揭晓

TradingKey中文

联华电子寻求通过发行双期限可转债筹集18亿美元

联华电子发行9亿美元可转换债券。

美股异动 | 半导体概念股普涨联电(UMC.US)涨逾4%

高通正在评估三星电子2nm晶圆代工工艺，并考虑将其应用于下一代移动芯片。

恩智浦半导体（NXP）宣布与VIS合资公司的首座12英寸晶圆厂在新加坡落成

AI热潮重塑晶圆代工格局！瑞银：需求爆发推动先进制程扩产提速成熟制程步入上行周期

AI热潮重塑晶圆代工格局！瑞银：需求爆发推动先进制程扩产提速成熟制程步入上行周期

台积电关联企业计划在新加坡建设第二座芯片工厂，推进亚洲布局

台积电参股的晶圆代工厂世界先进与欧洲芯片巨头恩智浦合资成立的 VSMC 新加坡首座 12 吋晶圆厂于 9 月 28 日

联瑞新材：半年度权益分派将调整联瑞转债转股价格并停牌

东吴证券：先进制程抬升材料价值量半导体含氟材料加速国产化

影响市场重大事件：国务院国资委：培育未来产业变量，不断向产业链价值链中高端迈进；海南推进航天旅游平台组建；成熟制程需求爆发，联电、力积电等晶圆代工厂酝酿涨价

每日经济新闻

成熟制程火热联电发动“有感涨价” 力积电传报价大涨四成

传AMD全系列芯片涨价10%！台积电晶圆代工成本走高成主因

United Microelectronics Corp(UMC)股票9月17日盘中上涨8.83%：释放什么信号？

TradingKey中文

时序进入第三季下旬，台积电3nm、2nm先进制程与CoWoS先进封装产能持续供不应求。供应链人士透露，英伟达、苹果等持续

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23:33","pubTimestamp":1790696017,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，周二，半导体概念股普涨，联电(UMC.US)涨逾4%，科磊(KLAC.US)涨3%，阿斯麦(ASML.US)、应用材料(AMAT.US)、日月光投控(ASX.US)涨逾2%。巴克莱银行在9月28日发布的半导体设备研究报告中，明确反驳了市场对于半导体板块近期回调的悲观看法。分析师Tom 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