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Corgi Lithography & Semiconductor Photonics ETF
23.74
-0.8501
-3.46%
成交量:
32.94万
成交额:
788.88万
市值:
4.19亿
市盈率:
- -
高:
24.26
开:
24.10
低:
23.60
收:
24.59
52周最高:
32.00
52周最低:
20.61
股本:
1,767.00万
流通股本:
1,767.00万
量比:
1.74
换手率:
1.86%
股息:
- -
股息率:
- -
净资产收益率:
--
总资产收益率:
--
市净率:
--
市盈率(LYR):
- -
数据加载中...
总览
公司
新闻资讯
公告
财报前瞻 | 阿斯麦(ASML.US)AI溢价迎Q3财报大考 EUV订单与业绩指引或成股价胜负手
智通财经
·
昨天
财报前瞻 | 阿斯麦(ASML.US)AI溢价迎Q3财报大考 EUV订单与业绩指引或成股价胜负手
智通财经
·
昨天
ASML痛批欧洲半导体停滞!全球唯一EUV供应商在欧洲一台设备都没卖出去
格隆汇
·
09/25
ASML痛批欧洲半导体停滞!全球唯一EUV供应商在欧洲一台设备都没卖出去
格隆汇
·
09/25
半导体ETF指南:SMH、SOXX、DRAM、EUV、SOXL,谁才是2026年最值得关注的芯片赛道工具?
ETF追踪
·
09/22
SK海力士目标2028年将High NA EUV技术用于DRAM内存量产
IT之家
·
09/11
三星与ASML合作开发下一代EUV光刻掩模版
格隆汇
·
09/09
据首尔经济日报,三星电子将与全球最大的光刻设备制造商ASML共同开发高数值孔径(High-NA)极紫外(EUV)光刻技术
智通财经
·
09/09
英特尔晶圆代工与阿斯麦深化合作,推动High-NA EUV用于更大尺寸AI芯片
TradingKey中文
·
09/08
瑞银:中国未来十年内难开发可媲美阿斯麦顶尖 EUV 光刻设备,DUV 量产或需两至五年
链捕手
·
09/02
三星电子计划在1nm级制程节点实现High NA EUV商业应用
格隆汇
·
08/12
三星计划 2030 年 1 纳米工艺导入 High-NA EUV 技术
链捕手
·
08/11
SK海力士据报推进EUV工艺 引入新材料PSM
格隆汇
·
08/11
SK海力士正致力于推进其极紫外光刻(EUV)技术,以实现下一代DRAM的量产。公司于去年首次推出高数值孔径(High-N
智通财经
·
08/11
消息称三星暂缓High-NA EUV技术量产,因财务考量而非技术瓶颈
IT之家
·
07/17
24小时环球政经要闻 | 7月16日
格隆汇
·
07/16
这家初创公司一天内推出了35只ETF——而且没有放缓的打算
路透中文
·
06/22
韩国简化极紫外光刻机进口审批流程
环球市场播报
·
06/02
韩国简化极紫外光刻机进口程序,以支持芯片产业发展
环球市场播报
·
06/02
英特格(ENTG)与JSR Corporation联合宣布就EUV光刻技术达成非独家交叉许可协议
金吾财讯
·
05/27
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EUV技术用于DRAM内存量产","url":"https://stock-news.laohu8.com/highlight/detail?id=2666511097","media":"IT之家","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2666511097?lang=zh_cn&edition=fundamental","pubTime":"2026-09-11 07:21","pubTimestamp":1789082463,"startTime":"0","endTime":"0","summary":"IT之家 9 月 11 日消息,参考路透社此前报道,SK 海力士在一份声明中表示,该企业目标在 2028 年将 High NAEUV 光刻图案化工艺应用于 DRAM 的大规模生产。SK 海力士正评估是否加入这一联盟。IT之家注意到,三星电子在同时新闻稿中确认计划在 2028 年将 High NA EUV 技术用于先进 DRAM 内存的大规模生产;美光则曾表示,计划为第 7 代 10nm 级 DRAM 工艺 1δ 导入最新一代的 EUV 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EUV设备用于大型AI和数据中心芯片制造。","market":"nz","thumbnail":"https://resource.tradingkey.com/cms_uploads/img/20240102/c0531811fe341e7a5268ef210c462723.jpg","type":0,"news_type":0,"thumbnails":["https://resource.tradingkey.com/cms_uploads/img/20240102/c0531811fe341e7a5268ef210c462723.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.tradingkey.com/zh-hans/analysis/stocks/us-stock/262155438-intel-foundry-asml-deepen-collaboration-promote-high-na-euv-larger-ai-chips-tradingkey","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["TMYY","LEGR","QQQA","WISE","ALAI","UMCX","SOXM","AIFD","AIBU","TSEU","TSMX","GPTZ","BGIA","AVGC","AVGX","EUV","AMDC","INT","INTC","CNAV","SHOC","TSMU","LRNZ","TSEG","TSXU","XSEM","TTEQ","AIS","FTXL","AIVC","INTW","TSMG","AMUU","XNTK","TSMY","ARMH","GFSG","TWSC","AIQ","LINT","AMDG","FAI","SEMY","TSMZ","SMHC","SINTCmain","03191","AMDL","CHPX","EPAI"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2664860323","title":"瑞银:中国未来十年内难开发可媲美阿斯麦顶尖 EUV 光刻设备,DUV 量产或需两至五年","url":"https://stock-news.laohu8.com/highlight/detail?id=2664860323","media":"链捕手","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2664860323?lang=zh_cn&edition=fundamental","pubTime":"2026-09-02 09:16","pubTimestamp":1788311804,"startTime":"0","endTime":"0","summary":" ChainCatcher 消息,据彭博社报道,瑞银集团分析师预计,未来十年内中国半导体制造能力可能难以取得足够快的进展,从而开发出能够真正替代阿斯麦尖端 EUV 光刻技术的方案。瑞银分析师在报告中写道,“他们目前所处的阶段似乎与阿斯麦在 2004 年时相当”,从专利申请活动来看,尤其是在光源和激光子系统领域,中国当前技术成熟度大致相当于阿斯麦开始大规模生产 EUV 设备前 15 年的水平。\n\n瑞银同时预计,中国有望在未来两到五年内具备浸没式 DUV 光刻机的大规模量产能力。浸没式 DUV 虽不如 EUV 先进,但仍是芯片制造不可或缺的设备。阿斯麦浸没式 DUV 售价近 9000 万美元,EUV 设备每台超 2 亿美元。中国是阿斯麦最大市场之一,但受出口限制,阿斯麦被禁止向中国出售 EUV 设备。瑞银指出,考虑到良率和产能差距及监管限制,中国光刻设备不太可能在境外得到应用。阿斯麦发言人对置评请求未作回应。该报道基于瑞银分析师的预测观点,实际进展以产业动态为准。 ","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.chaincatcher.com/article/2286995","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BGIA","EUV"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2658944014","title":"三星电子计划在1nm级制程节点实现High NA EUV商业应用","url":"https://stock-news.laohu8.com/highlight/detail?id=2658944014","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2658944014?lang=zh_cn&edition=fundamental","pubTime":"2026-08-12 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海力士,两家企业可更快完成高端芯片生产设备的装机投产。\n\n\n海量资讯、精准解读,尽在新浪财经APP\n\n责任编辑:王永生","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/usstock/c/2026-06-02/doc-inhzyxft1701102.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["EUV"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2640299429","title":"韩国简化极紫外光刻机进口程序,以支持芯片产业发展","url":"https://stock-news.laohu8.com/highlight/detail?id=2640299429","media":"环球市场播报","labels":["policyRegulatory"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2640299429?lang=zh_cn&edition=fundamental","pubTime":"2026-06-02 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