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Roundhill Memory ETF

54.72

-2.4700-4.32%

盘后：53.91-0.8100-1.48%19:59 EDT

成交量：3,234.61万

成交额：17.76亿

市值：225.58亿

市盈率：- -

高：55.81

开：55.74

低：54.40

收：57.19

52周最高：81.34

52周最低：26.14

股本：4.12亿

流通股本：4.12亿

量比：1.41

换手率：7.85%

股息：- -

股息率：- -

净资产收益率：--

总资产收益率：--

市净率：--

市盈率(LYR):- -

数据加载中...

总览公司新闻资讯公告

恒坤新材：TEOS目前产能利用率为50%以上

TrendForce：四季度DRAM供不应求涨势放缓，NAND Flash合约价季增15%-20%

AI需求分化：Token用量激增，H100跌价B200反弹，DRAM五连涨后首次回落

华尔街见闻

明年涨价121%？供应吃紧机构上调HBM价格展望（附股）

东方财富网

AI算力需求带动存储芯片升级，产业链景气度获机构看好

AI算力需求带动存储芯片升级产业链景气度获机构看好

东方财富网

349亿元不只是扩产：长鑫科技真正要补的是DRAM制造闭环

从349亿元看国产存储供应链：谁能真正接住长鑫扩产订单

存储芯片行情持续火热！伯恩斯坦：DRAM、NAND三季度价格或涨近20% 2028年周期或开始“正常化”

三星：明年HBM将占DRAM产能近30%，传统内存供应或进一步收紧

华尔街见闻

江波龙：“内存墙”的物理限制与高昂内存成本，已成大模型在端侧AI广泛应用的重要阻碍

美国对DRAM设备启动337调查，先看清它到底能影响什么

337调查落到供应链，DRAM国产替代会被加速还是被拖慢？

DRAM还在超级周期里吗？337调查之外，更大的变量是供需与资本开支

TrendForce：上修2027年HBM价格展望预估ASP年增达121%

集邦咨询：HBM供应持续吃紧上修2027年HBM价格展望预估ASP年增达121%

集邦咨询：HBM供应持续吃紧上修2027年HBM价格展望预估ASP年增达121%

机构：上修2027年HBM价格展望，预估ASP年增达121%

三星高管预计明年HBM将占到行业DRAM产能的近30%

三星高管预计明年HBM将占到行业DRAM产能的近30%

环球市场播报

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2028年周期或开始“正常化”","url":"https://stock-news.laohu8.com/highlight/detail?id=2671243132","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2671243132?lang=zh_cn&edition=fundamental","pubTime":"2026-09-29 22:46","pubTimestamp":1790693214,"startTime":"0","endTime":"0","summary":"DRAM、NAND三季度价格或涨近20% 供应短缺延续至2027年伯恩斯坦进一步上调了短期传统存储价格预期。其中，DRAM第三季度价格涨幅高于此前预计的12%。价格预测图显示，DRAM和NAND均处于本轮周期中非常强劲的涨价阶段。伯恩斯坦预计，DRAM行业毛利率可能在本轮周期高峰达到约90%，随后到2028年末回落至70%高位；NAND毛利率则预计回落至约65%。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1502368.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["MUD","RAMZ","BK4588","09747","FTXL","RAM","DRAM","DISK","HBMX","MIC","MUZ","MUG","DRMY","MULL","MUYY","DRAL","MUU","DRMP"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2671214758","title":"三星：明年HBM将占DRAM产能近30%，传统内存供应或进一步收紧","url":"https://stock-news.laohu8.com/highlight/detail?id=2671214758","media":"华尔街见闻","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2671214758?lang=zh_cn&edition=fundamental","pubTime":"2026-09-29 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ASP年增幅度将达121%。","market":"us","thumbnail":"https://static.szfiu.com/news/20241108/NzE1NDA5NTM3ODk1OQ==.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20241108/NzE1NDA5NTM3ODk1OQ==.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"1992755","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["MUZ","MUU","MIC","HBMX","DRAM","MULL","DRAL","DISK","MUD","BK4588","DRMY","RAMZ","MUYY","RAM","MUG","DRMP"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2671295579","title":"集邦咨询：HBM供应持续吃紧 上修2027年HBM价格展望 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ASP年增幅度将达121%。因此，在HBM供应持续紧张的情况下，8hi预计成为2027年多家GPU与ASIC厂商优先评估的方案，作为GPU厂商在性能、供应量与成本之间的折中方案。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1501956.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["RAMZ","MULL","DRMP","BK4588","MUD","DISK","DRAL","HBMX","MUG","MIC","MUU","DRMY","DRAM","RAM","MUZ","MUYY"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2671295572","title":"集邦咨询：HBM供应持续吃紧 上修2027年HBM价格展望 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13:42","pubTimestamp":1790660569,"startTime":"0","endTime":"0","summary":"来源：环球市场播报三星电子一位高管周二表示，预计明年高带宽内存（HBM）将占到DRAM芯片制造商晶圆总产能的近30%，高于目前的约20%。三星电子执行副总裁Kim Taewoo表示，HBM与标准DRAM争夺相同的晶圆产能，这意味着扩大HBM产量可能会限制标准DRAM的供应。HBM是人工智能计算的关键组件，由垂直堆叠的存储芯片构成，使处理器能够高速访问海量数据。该市场目前主要由韩国的SK海力士和三星电子以及美国的美光科技主导。\n\n美股频道更多独家策划、专家专栏，免费查阅>>\n\n            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Taewoo表示，HBM与标准DRAM争夺相同的晶圆产能，这意味着扩大HBM产量可能会限制标准DRAM的供应。HBM是人工智能计算的关键组件，由垂直堆叠的存储芯片构成，使处理器能够高速访问海量数据。该市场目前主要由韩国的SK海力士和三星电子以及美国的美光科技主导。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/usstock/c/2026-09-29/doc-initnfqp2927467.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["MIC","DRAM","HBMX","BK4588","RAM","MUU","RAMZ","MUD","MUZ","DRMP","DRAL","MULL","DRMY","DISK","MUG","MUYY","EMXC","BK4585"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":20,"pageCount":6,"totalSize":400,"code":"91000000","status":"200"}]}}